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Unternehmen
Taiwan Semiconductor Manufacturing Company Limited
Ort
Taiwan
Art des Jobs
Ingenieur / Verwaltung
Art der Beschäftigung
Regulär
Veröffentlicht
10.02.2025
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Zuständigkeiten
我們在第一線負責晶片製造過程,改善機台製程參數的設定,提升良率並讓機台每單位時間產出增加,也降低生產成本;半導體製程可大致分為四大模組,大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。

1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements.
2. Identify and solve IC process and device problems.
Qualifikationen
在這個領域發光發熱,要具備:材料、物理、化學、機械背景知識、團隊合作、邏輯思考、問題解決能力。

1. Master's degree or above in Electrical Engineering, Physics, Materials science, Chemistry or Chemical Engineering.
2. Semiconductor internship experience is preferred.
3. Exhibit good and open communication skills, be able to work within cross-functional teams. 
4. Fluent in English.