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Company
Taiwan Semiconductor Manufacturing Company Limited, TSMC
Location
Taiwan
Job Category
R&D
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Aug 30, 2024

台積公司成立於1987年,率先開創了專業積體電路製造服務之商業模式,自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展,以此釋放全球半導體產業的創新。身為全球的企業公民,台積公司的營運範圍遍及亞洲、歐洲及北美,致力成為企業社會責任的行動者。2023年,台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術,為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。

進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。


發揮所才、接力未來,台積電 R&D 是高手雲集的匯聚之地,

在這裡,每個人都身懷絕技、擁有超凡能力!


Corporate Research肩負最前瞻的研究,涵蓋下一世代非矽元件所需的新材料和製程、新興記憶體、晶片設計到AI系統架構,並與全球頂尖大學長期合作,探索每項創新的可行性。
Pathfinding則為未來技術節點,開創新型電晶體結構及材料、設備與架構、低電阻金屬導線、新型記憶體,推動最新前沿的邏輯技術與發展,以實現台積在晶圓製造上性能、功耗、面積和成本的領先優勢。
 
Corporate Research is responsible for the most forward-looking research, delving into the new materials and processes, advanced memory, chip design, and AI system structures required for the next generation of non-silicon components. Furthermore, Corporate Research has entered into long-term collaborations with top universities around the world in order to explore the feasibility of a wide range of innovations.
Pathfinding creates new transistor structures and materials, equipment and forms, low-resistance metal wires, and next-generation memory for the semiconductor manufacturing nodes of the future. By promoting the latest logic technology and development, TSMC can fully leverage its first-mover advantages in the performance, power, areas, and costs in wafer manufacturing.
Job Qualifications
1. 對開發世界領先的技術充滿熱情。
2. 工程或科學領域的碩士(含)以上學位,例如材料科學工程、電機工程、化學工程、機械工程、物理、化學或光學相關。
3. 對IC製程設備、流程整合、化學及物理具有扎實的技術底蘊。
4. 良好和開放的溝通技巧,能夠在跨組織團隊中工作,包括內部和外部合作夥伴。
5. 流利英語能力。
6. 具AI及程式設計相關技能者為優先考量。
7. 對統計製程管制(SPC)和/或實驗設計(DOE)原則有深入瞭解。具備機器學習或人工智慧相關知識者為加分優勢。
8. 能夠靈活地應變優先事項與工作職責,以協助組織單位需求。
9. 積極參與製程或設備工作並具有強烈的責任感。
10. 願意頻繁地進入Fab。
11. 需要具備基於基礎模型(而非經驗模型)的技術端問題解決和分析能力。
12. 需要具備優秀的書寫和口語溝通能力。

1. Passionate about the development of world-leading technologies.
2. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics.
3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics.
4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners.
5. Fluent in English.
6. Skills in AI and programming are preferred.
7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage.
8. Flexibility in changing priorities and responsibilities to support business needs.
9. Hands-on participation on process or hardware and a strong sense of ownership.
10. Willing to make frequent fab presence.
11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required.
12. Excellent written and spoken communication skills are required.

多元、公平與共榮呼應台積公司的核心價值和經營理念,對公司未來的成功至關重要。台積公司對多元、公平與共融的承諾,旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向,都能將其自身的觀點與經驗帶入工作,促進企業推升獲利、增加生產力並釋放創新。台積公司致力營造公平且無障礙的職場環境,對不同特質與需求的身心障礙同仁提供所需的資源。我們承諾促進共融文化,讓每位員工都感到被重視,且有能力為我們的企業使命做出貢獻,並為全球客戶提供卓越服務。