1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements.

2. Identify and solve IC process and device problems.

我們在第一線負責晶片製造過程，改善機台製程參數的設定，提升良率並讓機台每單位時間產出增加，也降低生產成本；半導體製程可大致分為四大模組，大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。

1. Master's degree or above in Electrical Engineering, Physics, Materials science, Chemistry or Chemical Engineering.

2. Semiconductor internship experience is preferred.

3. Exhibit good and open communication skills, be able to work within cross-functional teams. 

4. Fluent in English.

在這個領域發光發熱，要具備：材料、物理、化學、機械背景知識、團隊合作、邏輯思考、問題解決能力