Description:

1. Highly motivated veteran and new talents to join force research and pathfinding in Advanced packaging and system integration technologies for both extending Moore's Law and in post-Moore era.

2. Long prospective career path in semiconductor technologies looking at more Moore's and beyond Moore's Law Eco-industry.

Job Description:

1. Integration engineering for process integration and device/system level modeling, including electrical, thermal, and mechanical modeling.

2. Module engineering in advanced FEOL/MEOL/BEOL wafer process modules, and in advanced system packaging, including wafer level fan-out, interposers, and 3D chip stacking

3. Silicon photonics expertise in the following areas: optical components design (lens, modulator, detector, waveguide w/ various materials), photonic circuits design (w/ focus on optical communication), and computer system architect with focus on parallel processing and high-speed networking.

1. Solid skills build-up with hands-on operation.

2. Positions are reserved for those who have strong interest in emerging, exciting and disruptive technologies and for those who enjoys an intellectual-stimulating environment with work-life balance. Engineers and scientists from well-experienced to new in system integration and relevant fields are encouraged to apply.

3. Master's degree or above in Science/Engineering related field with strong motivation to grow in new field

4. Senior position in system-level pathfinding, innovative heterogeneous system integration, and technology road-mapping

5. Project/team management experience for management position.